See this:
https://www.electropages.com/blog/2023/10/iphone-15-pro-max-tsmcs-3nm-process-blame-heat
"However, one issue that many often overlook is overheating. Even though smaller transistors consume less energy than their predecessors, the
packing of more transistors into the same space actually results in an overall increase in heat generation, and this is commonly seen in desktop computers, which have evolved to require high-capacity heat sinks and fans (in some cases, liquid cooling)."
Recent reports have shed light on the heating issues faced by devices using the TSMC 3nm process. Specifically, the
iPhone 15 Pro Max has been observed to experience significant thermal throttling, especially during intensive tasks like gaming. Chinese reviewer
Geekerwan's tests showed that the device's surface temperature can reach up to 48°C when playing high-end games like Genshin Impact. This is concerning, especially when considering the potential risks associated with overheating, such as battery damage and reduced device lifespan.
TSMC under fire for hot 3nm parts
Currently, only a handful of devices around the world utilise 3nm parts, and arguably, one of the most iconic of these is the iPhone 15. The use of 3nm has allowed for multiple high-performance cores, AI cores, and much more to be packed into a tiny SoC called the A17 Pro.
However,
users of the iPhone 15 have reported that after 30 minutes of use, the mobile processor reaches temperatures exceeding 48˚C. While this temperature may be perfectly acceptable for semiconductor devices, in a mobile application, this temperature rise is potentially disastrous.
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The heating problem of the A17 Pro, as highlighted in the
recent reports, indicates a potential flaw in the TSMC 3nm process, which needs immediate attention.
