AMD, TSMC, Intel all have some kind publicly known technology for 3D chip-stacking. When asked on this forum in the past - there was the general opinion that Apple didn't need it for any existing chip design because there was plenty of room to expand out.
Now that we have a known size of a M1 Max, might that be a reason for Apple to start stacking (or try to)? Furthermore, might Apple adopt some kind of analogy to the shipping container (standard sizing, standard positioning of layering channels, etc) so that it's easier to adopt a stacking strategy to all their chips moving forward? Wouldn't that allow for a company like Apple to design chips that could be used in a spectrum of hardware - from phones to 'pro' workstations?
I know this is oversimplifying, but it'll be interesting to compare objections to this idea to similar objections to standardized shipping containers back in early days.
Now that we have a known size of a M1 Max, might that be a reason for Apple to start stacking (or try to)? Furthermore, might Apple adopt some kind of analogy to the shipping container (standard sizing, standard positioning of layering channels, etc) so that it's easier to adopt a stacking strategy to all their chips moving forward? Wouldn't that allow for a company like Apple to design chips that could be used in a spectrum of hardware - from phones to 'pro' workstations?
I know this is oversimplifying, but it'll be interesting to compare objections to this idea to similar objections to standardized shipping containers back in early days.
