Everyone knows our dusty machines vrm cooling section attached to cooling blocks. When we upgrade 2009 cMP's with 130W lidded CPUs, cooler height increase nearly ~2.2mm. After all, thermal pads should be used 4.5 or 5mm to avoid future overheat problems. Vrms forced extra and cooling solution inadequate.
The original thermal pad is silicon-based and very thin. Thermal conductivity is far better than 5mm fujipoly pads. I decided to buy 130x8x3mm copper heatpipe. So I'll glue heatpipe to cooler and use an original thermal pad or high conductivity thermal pad. What are you thinking? 5mm fujipoly pads or heatpipe solution?
BLOCK
Thermal Glue or Liquid Metal
Heatpipe (3mm, glued from edges)
Thermal Pad (Original or new one)
VRM
Heatpipe that I bought from Aliexpress: https://www.aliexpress.com/item/32952283372.html
When the parcel arrived, I'll share my experiences. Don't say me the vice method, I don't try. I prefer lidded cpu and washer method.
The original thermal pad is silicon-based and very thin. Thermal conductivity is far better than 5mm fujipoly pads. I decided to buy 130x8x3mm copper heatpipe. So I'll glue heatpipe to cooler and use an original thermal pad or high conductivity thermal pad. What are you thinking? 5mm fujipoly pads or heatpipe solution?
BLOCK
Thermal Glue or Liquid Metal
Heatpipe (3mm, glued from edges)
Thermal Pad (Original or new one)
VRM
Heatpipe that I bought from Aliexpress: https://www.aliexpress.com/item/32952283372.html
When the parcel arrived, I'll share my experiences. Don't say me the vice method, I don't try. I prefer lidded cpu and washer method.