If you follow the MBP forums you'll see endless discussion/complaints about heat with the Sandy Bridge processors. If heat is a problem with the relatively thick case of the MBP, how will the MBA disperse heat efficiently with the same processors in a thinner case?
(I realize that there is a lot of debate over whether the heat issue on the MBP is really a problem or not, but many people think it is)
yes, if you actually read those threads, you will realize a lot of it is garbage, as pointed out above.
and if you actually looked into your question, you would quickly realize that the CPUs that would go into the Air are NOT the same as the ones in the MBPs. saying all Sandy Bridge processors are the same is like saying all Intel processors are the same.
plenty of "Sandy Bridge = heat" threads have already appeared in the MBA forum as well, enough that we shouldn't be addressing this question again.
you seem like you did
some homework, which is good, but not quite enough before posting.
... the fact is the TDP of the CPUs in the MBP was increased by 10W, and its still unclear whether this resulted in a heat problem. the CPUs that are likely to go into the Airs are LV and ULV (low voltage and ultra low voltage) models, and the TDPs may in fact drop as compared from last year's model (when accounting for the 320M).
please, no more preemptive, confused heat concerns.