I've seen many threads in this forum about people dropping clovertown chips into existing woodcrest machines followed by a barrage of responses with failure predictions, particularly around the matter of heat dissipation, because the rest of the system has not been beefed up to cope.
So, what's the deal with these new 4C's then - is the cooling system modified, is the motherboard the same etc.
This is quite important to me because if everything other than then processor chips is the same then I would buy a 2C machine now then drop in some 4C chips in a couple of years when they're giving them away with breakfast cereals...
Have Apple published anything on this or will we just have to wait until some enterprising individual upacks one and rips it apart.
Sorry if it appears to be a dozy question
So, what's the deal with these new 4C's then - is the cooling system modified, is the motherboard the same etc.
This is quite important to me because if everything other than then processor chips is the same then I would buy a 2C machine now then drop in some 4C chips in a couple of years when they're giving them away with breakfast cereals...
Have Apple published anything on this or will we just have to wait until some enterprising individual upacks one and rips it apart.
Sorry if it appears to be a dozy question