Im wondering how the air bearing heat transfer between the chip/bottom layer and the spinning fins (Convection I take it) is so efficient compared to conduction through thermal paste (Why do we make a big deal about good thermal paste if that isn't a bottleneck point?
Also this thing probably cant be used in a mobile product because you have a huge spinning metal disk with a high rotational inertia that wont want to tilt (Like a gyroscope).
Im wondering how the air bearing heat transfer between the chip/bottom layer and the spinning fins (Convection I take it) is so efficient compared to conduction through thermal paste (Why do we make a big deal about good thermal paste if that isn't a bottleneck point?
Eh? From what I read they only replace the fins and fan part of the heatsink. The bottom plate and thermal paste would still be required...I think. Having something spinning above a naked processor would be pretty risky in my book.
Eh? From what I read they only replace the fins and fan part of the heatsink. The bottom plate and thermal paste would still be required...I think. Having something spinning above a naked processor would be pretty risky in my book.
Eh? From what I read they only replace the fins and fan part of the heatsink. The bottom plate and thermal paste would still be required...I think. Having something spinning above a naked processor would be pretty risky in my book.
As noted in the article this might not work in vertical installations. I also fear that, just as we are moving away from spinning disks for our main bootup drives, we know have to worry about the CPU fan "crashing?"