Im wondering how the air bearing heat transfer between the chip/bottom layer and the spinning fins (Convection I take it) is so efficient compared to conduction through thermal paste (Why do we make a big deal about good thermal paste if that isn't a bottleneck point?
Also this thing probably cant be used in a mobile product because you have a huge spinning metal disk with a high rotational inertia that wont want to tilt (Like a gyroscope).
I'll be waiting to hear more in the future.