Hey man you never know AMD’s engineering has come a long wayI’m confident Epyc will not be in any laptops.
For what purpose would you have a server class cpu in a laptop?Amd just teased their new Zen 4 epyc cpu with 128 cores what are your guys thoughts on it
Hey man you never know AMD’s engineering has come a long way
That’s 400 W for CPU+GPU, that is currently kind of hard to beat for the competition considering that the GPU part is very capable.While they are both a CPU, they are totally different product meant for totally different sectors.
4 x M1 Max (40 cores, 128 gpu cores) theoretically can consume 400W given a single Max uses 100W. Then perhaps.
The only problem is, is that a laptop with a 128 core Epycc cpu will be loud and drain the battery in a couple of minutes.
I have always said it many years already, Apple should have switched to AMD instead of sticking with Apple.
Well of course. The combined CPU-GPU solution is incomparable to anything PC side is offering. I was mentioning that in terms of thermodynamics vs AMD 400w chip.That’s 400 W for CPU+GPU, that is currently kind of hard to beat for the competition considering that the GPU part is very capable.
Form Factor (As of 9 Nov 2021) | AMD Zen 4 Epyc 128 core cpu Rival | AMD Zen 4 Epyc 128 core cpu Rival | Mac Pro iMac Pro | Mac mini Pro Mac Pro iMac Pro | MBP 14" MBP 16" Mac mini Pro iMac 24" iMac Pro | 300mm² Silicon Wafer |
Apple silicon chip | M1 Max Jade-16C | M1 Max Jade-9C | M1 Max Jade-4C | M1 Max Jade-2C | M1 Max | ? |
Launch | ? | ? | Q2 or Q4 2022 | Q2 or Q4 2022 | Q4 2021 | ? |
# of dies | 16 | 9 | 4 | 2 | 1 | 49 |
CPU | 160 | 90 | 40 | 20 | 10 | 490 |
performance cores | 128 | 72 | 32 | 16 | 8 | 392 |
efficiency cores | 32 | 18 | 8 | 4 | 2 | 98 |
GPU core | 512 | 288 | 128 | 64 | 32 | 1568 |
Neural Engine core | 256 | 144 | 64 | 32 | 16 | 784 |
memory bandwidth | 6.4TB/s | 3.6TB/s | 1.6TB/s | 800GB/s | 400GB/s | 19.6TB/s |
Max Memory | 1024GB | 576GB | 256GB | 128GB | 64GB | 3,136GB |
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW | 16 | 9 | 4 | 2 | 1 | 49 |
Video decode engines | 16 | 9 | 4 | 2 | 1 | 49 |
Video encode engines | 32 | 18 | 8 | 4 | 2 | 98 |
ProRes encode and decode engines | 32 | 18 | 8 | 4 | 2 | 98 |
Peak Quoted Transistor Densities using TMSC's 5nm (2020) at the same die size 171.3 million transistors per mm² | 912 Billion | 513 Billion | 228 Billion | 114 Billion | 57 Billion | 5.19 Trillion |
Estimated Die Size | 17.004cm² | 12.753cm² | 8.502cm² | 6.3765cm² | 4.251cm² | 30cm² |
Peak Quoted Transistor Densities using IBM's 2nm (2025) at the same die size 333.33 million transistors per mm² | 1.774 Trillion | 998.24 Billion | 443.66 Billion | 221.83 Billion | 110.92 Billion | 10.1 Trillion |
Estimated AMD Ryzen 9 5950X Performance | 16x | 9x | 4x | 2x | 1x | 49x |
Estimated RTX 3080 Performance | 16x | 9x | 4x | 2x | 1x | 49x |
Obviously to provide kubernetes* to your local coffee shopFor what purpose would you have a server class cpu in a laptop?
Using TSMC's chiplet tech it is possible to mask stitch 9-16 M1 Max dies together to reach 90-160 CPU cores together.
Form Factor (As of 9 Nov 2021) AMD Zen 4 Epyc 128 core cpu Rival AMD Zen 4 Epyc 128 core cpu Rival Mac Pro
iMac Pro Mac mini Pro
Mac Pro
iMac Pro MBP 14"
MBP 16"
Mac mini Pro
iMac 24"
iMac Pro 300mm² Silicon Wafer Apple silicon chip M1 Max Jade-16C M1 Max Jade-9C M1 Max Jade-4C M1 Max Jade-2C M1 Max ? Launch ? ? Q2 or Q4 2022 Q2 or Q4 2022 Q4 2021 ? # of dies 16 9 4 2 1 49 CPU 160 90 40 20 10 490 performance cores 128 72 32 16 8 392 efficiency cores 32 18 8 4 2 98 GPU core 512 288 128 64 32 1568 Neural Engine core 256 144 64 32 16 784 memory bandwidth 6.4TB/s 3.6TB/s 1.6TB/s 800GB/s 400GB/s 19.6TB/s Max Memory 1024GB 576GB 256GB 128GB 64GB 3,136GB Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW 16 9 4 2 1 49 Video decode engines 16 9 4 2 1 49 Video encode engines 32 18 8 4 2 98 ProRes encode and decode engines 32 18 8 4 2 98 Peak Quoted Transistor Densities using TMSC's 5nm (2020) at the same die size171.3 million transistors per mm² 912 Billion 513 Billion 228 Billion 114 Billion 57 Billion 5.19 Trillion Estimated Die Size 17.004cm² 12.753cm² 8.502cm² 6.3765cm² 4.251cm² 30cm² Peak Quoted Transistor Densities using IBM's 2nm (2025) at the same die size333.33 million transistors per mm² 1.774 Trillion 998.24 Billion 443.66 Billion 221.83 Billion 110.92 Billion 10.1 Trillion Estimated AMD Ryzen 9 5950X Performance 16x 9x 4x 2x 1x 49x Estimated RTX 3080 Performance 16x 9x 4x 2x 1x 49x
Using TSMC's chiplet tech it is possible to mask stitch 9-16 M1 Max dies together to reach 90-160 CPU cores together.
Amd just teased their new Zen 4 epyc cpu with 128 cores what are your guys thoughts on it
Let’s talk about the 2-4 chiplet design within the next 12 months.Pragmatically not. All of TSMC's "chiplet" technology have reticle limits for 2.5d and 3D packaging. (they are getting bigger each year but there is a cap to current tech ). They could just go with just packages on a effectively just a printed circut board then loose lots in bandwidth/power effectiveness. The other issue is soak up all the package space with CPU die then won't have space for the RAM ( and again loose some bandwidth/power upsides that Apple is leveraging. )
A fan-out of that many tile would also likely have significant NUMA issues to work around. Pretty doubtful Apple wants to get into hard core NUMA triage issues. The GPU won't scale well with high likelihood for a screen output workloads.
macOS doesn't even handle more than 64 threads. No rational reason to go where the OS doesn't go. Even more so on a laptop ( which is 70+% of the macs sold and 100% of the iPad Pro's sold). It isn't where Apple's revenue money is.
Even getting to 4 chiplets/tiles would with minimal NUMA overhead would be a significant technical feat for Apple. Double digits? They have not even a seed of tech to do that right now and still fully meet their "highest perf/watt" mantra.