There was a lot of discussion on release about how no matter what you do the thing stays dead quiet and there had to be room to go harder with performance if desired.
The empty PCI-e slot covers of the Mac Pro are high-end tensile strength solid aluminum. Grossly over engineering. There is a fan just to blow air only over the RAM , SSD and the underside of the CPU mount point. How many systems out there are engineered to have just RAM fans? Same thing for most of the MPX modules. For most, part thermally over engineered for most modules.
Apple may have downclocked the 580X a bit to fit more comfortable in the "half" module , but it isn't anywhere near as kneecapped as the MBP 16" components are by its enclosure. The Pro Vega Solo pragmatically has a Duo heat sink sitting on it. Think going to overclock into the zone of another package worth of heat without damaging the die? The only one even close to the edge is the Duo.
"Pro Mode" on the MBP 16" is basically turning off the limiters that Apple put on the components because "thin" mattered more than doing it "correct" in terms of container-thermal constraint interactions. The Mac Pro is gross 180 turn in direction Apple got caught painted into a corner with the Mac Pro 2013 and so finally Apple took the constraints off doing a thermally conservative ( with lots of head room) design.
I think a lot of people that need the horsepower were hoping that was the case.. yes even if it includes overclocking.
"Pro Mode" in the MBP 16" wasn't about overclocking. It was about bring the components but up to levels would nominally hit if were in a non-thinned-out 6-7l lbs , workstation laptop from a variety of vendors.
Looking for overclocking over spec from Apple is like looking for a BBQ pork ribs at a Kosher deli.