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AMD Confirms RX 480 At $199 USD, Other APU & Polaris Announcements
- Thread starter lowendlinux
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@xSinghx: Start reading here: https://forums.macrumors.com/thread...is-announcements.1975249/page-8#post-23070337
In short: It's looking good, but support isn't 100% there yet.
In short: It's looking good, but support isn't 100% there yet.
Sapphire's 480 looks like it has much better power management and OC by default
http://wccftech.com/sapphire-rx-480-nitro/
http://wccftech.com/sapphire-rx-480-nitro/
That's looking much better. By the time I'm ready to buy these cards should be in good shape for my build.
Interesting design, open fan type, but mainly blow the hot air to the PCIe slot. Only a small windows at the back of the card for the hot air to escape (in the cMP).
The cMP has a case fan for the PCIe zone, so the case airflow will push the heated air out the back.
Many, maybe most, GPUs are similar in circulating case air, rather than using a centrifugal blower pushing air out the back.
But the back end of the PCIe compartment is just a wall (except that little window on the graphic card).
So, you mean the PCIe fan + the graphic card's fan(s) should effectively direct the hot air leave the PCIe zone via that little windows?
Because heat travels in the direction of coolness. It's expressed in the second law of thermodynamics
)While I'd agree with you that the RX 480 most certainly won't make your mainboard go up in flames, I wouldn't trust someone on this matter who obviously doesn't know the difference between voltage and current.
It's current that's out of spec, voltage will drop under load though.
Still, AMD should have seen that one coming when designing the board.
I wonder how these boards pass PCIe SIG tests if they don't comply.
Still, AMD should have seen that one coming when designing the board.
I wonder how these boards pass PCIe SIG tests if they don't comply.
Assuming that the board use for the SIG cert test are the same as those being sold. Not saying that's the case here, but seing how all sort of electrical gear manufacture in China being sold here present all sort of defects when cracked open and inspected independently, one wonder how much follow up work does the certification authorities do after issuing those same certifications.
Again, not saying that AMD does this at all in this case, but the possibility does exist.
Again, not saying that AMD does this at all in this case, but the possibility does exist.
Because heat travels in the direction of coolness. It's expressed in the second law of thermodynamics
But air travels in the direction it is being blown. Aerodynamics largely trumps thermodynamics when it comes to air movement. That's why cooling systems work.
While there may be some airflow reflection from the back of the Mac Pro to the front, the machine is primarily a front-to-back cooling system. Expecting a significant heat amount to come out the front is a dubious expectation. The old Mac Pro models are just as much a "cheese grader" on the back as they are on the front. Given the air is mostly being driven front-to-back that is likely where most of it is going. With all of the internal obstructions (and 'chaos' blowers not on the front-to-back plan ), some will escape through the front ( and subset of that will be ingested into the intake.... not really helping much).
This whole Russian Roulette as to which cards blow which way is probably one of the main reasons while Apple dumped it from the new Mac Pro design. Generic cases are bigger (more capacity ) to soak up the chaos. It is not a more effective thermodynamic design; just more slack available to soak up the ineffectiveness.
Take it with an truck load of salt:
DNG says then next TB3 Display to be available only on 21"4k format no 27"5K Apple to resell an yet un-announced LG 27"+ 5K display, FUTHER ALL USB-C Ports on the nnMP to be DisplayPort 1.4 Enabled also those with Thunderbolt 3.
DNG says then next TB3 Display to be available only on 21"4k format no 27"5K Apple to resell an yet un-announced LG 27"+ 5K display, FUTHER ALL USB-C Ports on the nnMP to be DisplayPort 1.4 Enabled also those with Thunderbolt 3.
You're describing the movement of molecules (in this case 'air'). Heat can transfer in the opposite direction of the flow of air if the conditions force it to.
It can, but only by a negligible amount in the whole cooling process. If the heat can effectively escape from the front, you can feel it by your hand, that's simple logic and physics.
Molecules eh!
Anyway more to the point, cool air flows out from both ends of the mac pro.
If you need proof, then apply the first law of common sense which in this case is put your hand at the back and front of your cMP. Any heat build up escapes front and back thats why there is the cheese grate design both ends.
But you can feel it with your hand, especially if you have the kind of hardware that generates enough heat. I used to put my hand there often when I first installed the 980 and it used to make so much noise.
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This is what I said :/
I'm a little dismayed at having to post this.. but here goes.
The reason there are holes at the front is to be able to draw cool air in. This is passed through the case, and out of the back.
The reason there are dividers is to separate the case into independent zones; so that heat dissipated into the case can be controlled. There are additional fans at the rear bottom to pull hot air out from the CPU bay, as this gets especially hot.
Honestly can't believe some people on here don't understand that..
My only point is that if the heat is excessive enough then the front fans will not be enough to prevent heat escaping from the front, and this is exactly what happens. In fact, due to the compartment design and small fans of the cMP, excessive heat is forced to escape from all directions even in the direction where air is being pulled in from. We should all know this by now? Sure.
Back to AMD.
I know absolutely I can't believe it either.
Oh well, we have covered it, I think SoyCapitan sees.