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Will a Mac Pro 7,1 be announced Sep. 7th?

  • Yes

  • No


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Flint Ironstag

macrumors 65816
Original poster
Dec 1, 2013
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Houston, TX USA
Disappointed this hasn't been done already, so here goes :D

Will a nMP be announced Sep. 7th or not?? VOTE.

Bonus points if you guess the configurations correctly.

DO eet!
 
Even if they did, what could they possibly release that would make this forum happy?

Face it, Ive's trash can design is, well, trash.

It can't support the thermal load of any modern day components without sounding like a jet engine, which means that if Apple did update it, they'd be forced to include underpowered components just to try and keep the thing quiet. At that point, everyone would be wondering the exact same thing they did at launch- "why is this machine lagging behind off the shelf hardware by a few years?".

They're not going to re-release a new tower system because that Apple is long dead. You're dealing with a company here who looks at technological advances as a way to make things smaller, thinner, and lighter, instead of something that means you can cram more resources in the same amount of space. If you need something more powerful then a cMP, it's time to look elsewhere, or build a hackintosh if you really must run OS X.

-SC
 
I'm not a student of thermal or power envelopes, but I think most folks would be satisfied if not happy with the following at the top end:

- 20 cores at decent GHz
- dual (under clocked) 1070s
- TB3
- and with Sierra, official support for eGPU

Am I crazy?
 
Even if they did, what could they possibly release that would make this forum happy?

Face it, Ive's trash can design is, well, trash.

It can't support the thermal load of any modern day components without sounding like a jet engine, which means that if Apple did update it, they'd be forced to include underpowered components just to try and keep the thing quiet. At that point, everyone would be wondering the exact same thing they did at launch- "why is this machine lagging behind off the shelf hardware by a few years?".

They're not going to re-release a new tower system because that Apple is long dead. You're dealing with a company here who looks at technological advances as a way to make things smaller, thinner, and lighter, instead of something that means you can cram more resources in the same amount of space. If you need something more powerful then a cMP, it's time to look elsewhere, or build a hackintosh if you really must run OS X.

-SC

That trash can design saved us a lot of time and energy this week as our shoot locations and studio set up has to shift a lot during building refurb. We just pick up the machine with one hand, minutes later we are set up somewhere else.
 
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I've never understood why Akitio, etc. don't offer a full-sized enclosure with proper power and cooling. If you're going to do eGPU, get a proper card!

Draeconis, curious what type of workload your machines saw. Were they running at full load most of the day? I'm hearing about 6,1s dying more and more.
 
Even if they did, what could they possibly release that would make this forum happy?

Face it, Ive's trash can design is, well, trash.

It can't support the thermal load of any modern day components without sounding like a jet engine, which means that if Apple did update it, they'd be forced to include underpowered components just to try and keep the thing quiet. At that point, everyone would be wondering the exact same thing they did at launch- "why is this machine lagging behind off the shelf hardware by a few years?".

They're not going to re-release a new tower system because that Apple is long dead. You're dealing with a company here who looks at technological advances as a way to make things smaller, thinner, and lighter, instead of something that means you can cram more resources in the same amount of space. If you need something more powerful then a cMP, it's time to look elsewhere, or build a hackintosh if you really must run OS X.

-SC

Been using my fully maxed 6,1 for 4k video professionally for almost 2 years almost every workday, I've personally never experienced any issues like the ones you mentioned, specifically the fan part. It's always been very quiet. Maybe I have the only good one they made?

I agree with you and most posters though, would love to see a more powerful system, specifically a dual CPU system (that way it could also eat more than 64gb ram). I've never been convinced by anyone that the second GPU does anything other than just sit inside there taking up space. If I could have, I would have configured this thing with faster clock dual 6 (12) or 8 (16) core and 1 graphics card. That would have been plenty. As it is today I don't see why anyone would buy one, the 5k iMac could complete my tasks more or less the same. Apple really needs to do something with Mac Pro, sooner than later.

With all of these thermal complaints it's surprising old Ive'ey and his team don't try to better engineer a liquid cooling system for both Mac Pro and iMac. We've come along way since the G5.
 
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The September event is undoubtedly only going to be focused on iOS devices with the iPhone being the focus. Very little of the people who care about these devices are interested in the mac pro.

My bet is we see some sort of mac focused event in october with new macbook pros, a new display and hopefully a mac pro.
 
With all of these thermal complaints it's surprising old Ive'ey and his team don't try to better engineer a liquid cooling system for both Mac Pro and iMac. We've come along way since the G5.

There's not really any need to go with liquid up close, considering what can be done today with Thermal Pyrolytic Graphite (TPG) designs ... how does 200W/cm^2 sound? And tested it from -50C to +200C ... robust enough for ya? Now if only the vendor was geographically located in the Bay Area ... oh, wait, they check off that box too.

-hh
 
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There's not really any need to go with liquid up close, considering what can be done today with Thermal Pyrolytic Graphite (TPG) designs ... how does 200W/cm^2 sound? And tested it from -50C to +200C ... robust enough for ya? Now if only the vendor was geographically located in the Bay Area ... oh, wait, they check off that box too.

-hh

I will have to look into that, never heard of it!

BTW to answer the poll, I think it's pretty obvious this will be a phone only event, which is kinda sad based on all the rumor reports of next years phone already. I think we need a "Back to the Mac" event again.
 
Sure it is. It has been part of the Thunderbolt / LightPeak specification from the beginning. Here's a demo from 2012. Intel did several public demonstrations as well.


Its always been possible because its just PCIe over thunderbolt, but until TB3 it was never sanctioned by Intel. It took them and graphics cards manufacturers some time to figure out what to do if your display adapter suddenly gets disconnected. Things like kernel panics happen when PCIe devices suddenly disappear.
 
It was never promoted as hot swappable, but I'm damn certain it was in the white papers. Anybody got a link handy? If not I'll dig up some sources after work. And yes, Intel has demonstrated this since Thunderbolt 1 / LightPeak.
 
I will have to look into that, never heard of it!

For a basic point of reference, TPG's thermal conductivity is roughly 10x that of aluminum 6061T6. There's some technical caveats on how to use the stuff, but there are companies who have worked out effective solutions. The other tech that's in this realm is pulsating heat pipe; a few companies are proficient with both tech's. In general, you can probably think of either of these as an effective heat spreader/transporter to move it a few cm to get it out of your densely packaged subsystem to where the design has more room to get the heat overboard.

BTW to answer the poll, I think it's pretty obvious this will be a phone only event, which is kinda sad based on all the rumor reports of next years phone already. I think we need a "Back to the Mac" event again.

Agreed, unfortunately.
 
.... In general, you can probably think of either of these as an effective heat spreader/transporter to move it a few cm to get it out of your densely packaged subsystem to where the design has more room to get the heat overboard.

Is heat spreading the root cause issue? The Mac Pro has one and only one fan. 35-50% of the diameter of the plane that fan is on is taken up by the WiFi system. ( which has way worse thermal conductivity than Alum does so a heat spreader doesn't do squat. You really don't want to spread heat there anyway. ) . 6 in is about 160mm fan. 65% of that is about 100mm fan... for a 450W, low noise system.

You could embed a thin layer of TPG inside the Thermal core to aid in spreading. It would drive costs significantly up (it is now a even more complicated machined assembly of parts). The Alum will still be around because TPG does nothing for structural issues (which the thermal core also is). The Thermal core could be heated more evenly top to bottom, but if you don't efficiently drive enough air over the surface you haven't really accomplished much.

the MP probably needs to be incrementally bigger (e.g., 1" in diameter and height). With that you can put in a larger effective diameter fan. ( move more air at the same speed/noise. ). Probably can get the SSD(s) off of the backs of the GPU cards. If moving enough air then can add other stuff to move the heat closer to the moving air if still have a problem.

Pulse pump , liquid cooling , etc. ... takes heat where? Unless there is enough air to deal with the heat that is just a ballon squeeze on the problem.

The current Mac Pro doesn't seems to be designed for a 12 core and a D700 and another D700 all to be "lit up" concurrently for extended periods of time. One 100mm fan to cover all of that .... really that was going to work? The design seems more geared toward human interaction kinds of endurance and speeds ( where 'race to sleep' is effective and there are number peaks and valleys of work. because occasionally humans stop to look at what they are doing. )
 
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