As I recall, the surface of the processor/heat sink interface is around 10 or 12mm square or so (didn't measure it, and that's a conservative estimate), so your 1mm gouge would represent less than 1 percent of the contact area.So I took off CPU A Heatsink and cleaned it. And then I saw a a hole in the copper of heatsink A. I then remembered that I had seen that when I did the upgrade. The hole had no thermal compound in it. Basically it was a bubble of air on the CPU. So I cleaned everything extra extra extra carefully and thoroughly. Then instead of the pea shaped/sized drop I did the first time I put a line of thermal compound on the cpu. Carefully placed the heatsink back on the cpu. Screwed the hex screws in and took my time and you guys were right, they do just stop at one point. I did the cross pattern for one full turn on every screw. The idle temperature of CPU A is now 45-46deg. And Full load on 64bit Geekbench hit 81 deg. I was hoping to keep it below 78.5 deg as per Intel's specs on these X5690 chips. Im not really sure what else I can do at this point to lower the temps.
Ive read some people talking about "lapping" the heatsink.
I assume that means polish to some degree. But I dont have any tools that can do that.
Plus the hole is a pretty serious hole. It's like a gouge. About 1mm deep and 1mm in circumference. And the internal color of it is not copper. It's like copper is only a surface treatment on the heatsink. Like a coat of copper.
What are your thoughts?
And thank you guys again for the info and the support.
I think my full load GeekBench ran about 80C, but it backed off immediately after the test. I think you're fine, unless you plan on making a living running GeekBench all the time.
In any event, runs cooler than than a 5K iMac.