I didn‘t mean multiple SoCs, I meant a single system on a package, stitched together from multiple „tiles“ aka. chiplets. As to redundant components (SSD controller, display engine etc.), they could be either off-loaded to a separate chip (on the same package of course), or just disabled. It’s not like they are taking much space. Or maybe, multiple display engines can be used to enable more displays etc.
The problem with big chips is that they are getting progressively more and more expensive, not just because of the size, but also because it gets very hard to make a defect-free chip. Smaller chips simply have higher yields. At the current level of complexity, it really starts to be one a problem. That’s why industry is moving towards scalable technologies, where you make small chips and connect the, together to act as one big chip. AMD is a success story in this area, Intel is introducing their scalable tech next year, and it will probably come to GPUs sooner rather than later too.
Apple is the owner of some very advanced chiplet-related patents, they have a focused product line and a lot of experience with economies of scale (just look at M1, it’s a marvelous product). Chiplets would be exactly their style as they would allow them to offer multiple configurations at various performance levels at a very reasonable amortized R&D cost. And of course, the leaks point towards this as well.