First off, most of the power cutting of the 7990 is through binning (the chips themselves, according to that article). Second, further power savings by consolidating the circuitry of 2 cards into 1 may or may not be significant, but even if it is: Isn't imagining a master/slave card being linked over the PCIE 3.0 port of the nMP a bit of a stretch?
All we've figured out so far: If Apple is just using scaled-down W9000's, the wattage requirement relative to the 450W spec is astronomical. Through binning (like on the 7990 reference does), they can shave off quite a lot. Through consolidation of circuitry, they can perhaps shave a little more. Through quick-idle and smart distribution of resources, perhaps more can be shaved (though I'm skeptical as to which tasks and how much).
Even if all these were rolled into one product (currently conjecture), we'd still be at a pretty significant power deficit.
I think all you guys are missing my point. You cannot pull 275 watts out of 365mm^2 of silicon without high flow chilled coolant and maybe welded heat exchangers.
Sorry but the idea that some die bin out at 275 watts and others at 150 watts is ridiculous. If some die can run at 20% less voltage for a given speed, they will consume 20% less power but to believe 100% voltage variation die to die is crazy.
I don't claim to know what the current budgets are for each chip in the new mac pro but to assume throttling is premature. Most of the unicorn hair and pixel dust is in this thread.