The price for a 300mm N5 wafer is allegedly $16,988.
That brings it down to a mere $130 per chip at those yields.
Cheap! The i5-1038NG7 has a "recommended customer price" of $320. I'm sure Apple gets some kind of volume discount, but I doubt it cuts the price by more than half!
I figure they can probably salvage a big chunk the bad chips too. These bigger dies are more defect-prone, but at least they're binnable, while a bad A14 just has to be thrown out. Too bad TSMC missed their target for ramping up N5P--the M99 would've been a great candidate for low volume production to iron out any issues with the process ahead of the A15.
Yeah, I see what you mean. It's an issue of initial heat transfer more than overall heat dissipation. No idea what modern vapor chambers are capable of...
Ok, I'm pretty confident now that if Apple leaves the two big fans they've got in there things should be fine. A design like this would work:
That's a Matebook 14. Same thickness as a MBP16 and uses a single APU (Ryzen 4800H) with two heat pipes pulling heat away to two separate fans. Sustains at 37W over 1.57cm2--23.57W/cm2.
Most people I've talked to think it wouldn't be a problem for heat pipes to pull heat away from the APU quickly enough as long as the fans are large enough and powerful enough to shed the heat. And based on its size (it's 1.1 MBP13s or .8 MBP16s by volume), the limit on the Matebook 14 probably has more to do with total heat dissipation than heat/area.
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