Even with 2 years out, it’s not hard to imagine A15 chipsets are making their way around a lab today for testing and prototyping.
A15 for the phone ( iiPhone 13 or whatever if they skip '13' ) ? Sure. First, because it isn't 2 years out it more pragmatically close to 1 year out. ( they'd to start production of the A15 in June-July to hit the September release. ).
Second, it is a substantially simpler SoC. There won't be :
64 (or more ) PCI-e v4 lanes on it.
It won't handle 100+ GB DIMMs. Or RAM capacities topping out in quad digit gigabytes.
It won't handle ECC base Memory.
It won't handle SATA. (more PCI-e lanes and a 3rd party discrete controller probably)
It won't handle wired Ethernet.
It won't handle discrete Thunderbolt v4 controllers
etc.
It is the title of this thread that isn't the minimal bar. The first post says specially questioning whether this is going to cover the top end range of the current Mac Pro.
Some iPad Pro RAM capacity sized render model isn't really the metric. If there is either a "host cores only , very large render model working-space " ( 20+ cores & 384+ GB ) or needed lots of cores to keep 3-6 large discrete GPUs feed with commands. So no, the iPhone 13 phone chip probably isn't going to drive that.
The fact that the A15 is on a hard 12 month cycle deadline ( and the future A series ) are also on a 12 month deadline . precisely leads into why Apple probably is not pulling the Mac Pro forward in the transition plan. It is a bigger job but probably doesn't have the top priority on resources. So as folks have "extra time" it will get worked on. if the A15 or A16 gets off track and Apple needs resources to fill gaps then more than likley they'll be pull off the super low volume Mac Pro SoC if helpful in closing the gap. The Mac Pro SoC probably isn't going to push A-series out of the way on physical resources either ( sim time , FPGA time , etc. )
Apple has worked on the A1_X chips only on process shanks the last couple of cycles. 12X (skip A13) 14X etc. The Mac Pro SoC probably would be on an even slower cycle. ( personally wouldn't be shocked if every 4 years but perhaps around every 3 years. If the product isn't being updated every year then not going to work on a SoC every year. The iMac Pro hasn't moved since 2017 ( about 3 years now). MP 2013-2019 6 years MP 2010-2013 3 years. It is highly likely going to be a long cycle product. ).
It’s mostly definitely not the final design, but more so today than before, hardware needs t exist to start optimizing around, and the like..
Optimizing? So what happened with Mac Pro class CPUs from 2014-2016 that Apple skipped there was optimizing around those? Apple optimizes USB output in macOS? Apple maximizes OpenCL throughput relatively to other operating systems' results ? The foul ups , bloops and blunders of the last couple macOS releases ... Apple should be more concerned about 'working' than 'optimized'.
I wouldn't be surprised if there was an iMac SoC 'design mule' board designed to drop into an Mac Pro case for convenient camouflage ( along lines of stuffing a modified iPad Pro board inside a Mac Mini case. ). Two 8-pin connectors to aux power one standard PCI-e slot for a AMD prototype add-in-card. ( so don't have to embedd the pre-production AMD GPU chip board. And one slot gets rid of PCI-e v4 retimer needs when put relatively huge gap between CPU package and primary GPU slot. ). 64-128GB sized RAM . That system probably would have decent chance of covering part of the lower half of the performance spectrum the Mac Pro currently covers.
However, a small scale board stuffed inside a Mac Pro case is huge stretch to classify as a Mac Pro prototype.
I’m almost positive it exists in varying forms of stability
The A-Series is not the Mac Apple Silicon series. the Mac SoC are, at minimal, going to have different 'stuff' wrapped around the basic building blocks in the SoC.
To lower R&D costs on the Mac Pro SoC Apple probably will borrow whatever they can get away with from the A15. But that also means should finished off the design after have the major kinks worked out of the A15 ( since leveraging "hand me down" design elements. ). Consequently, that means most likely will tape out substantially later than the A15 does.
Putting the 3-4x bigger 5nm SoC on more mature fab process tech a year later will also help control costs. It is way more expensive to roll out the biggest dies on the the most bleeding edge fab tech.