I will ask again. W9000 with 6 GB of VRAM has 250W TDP. How come it is not able to work in thermal envelope that is half that? How come it can be too hard for it? Don't you think that if that is the case, then the problem should be MUCH bigger in 250W thermal envelope? And this is limited in GPU BIOS.
I don't know how many different ways I can say this, the problem, as I've heard it described, relates to the implementation of the extra 3gb of VRAM, which is a custom design for Apple's cards - not the same design as that used in the FirePro, so what the FirePro, or even the retail Radeon are rated for, or capable of, isn't really relevant.
For whatever reason the custom design of the Apple card is causing some component in the GPU boards to overheat. Overall power draw and TDP are not the problem here, whatever is going wrong, the system isn't protecting itself against it - perhaps there's some part with higher electrical resistance and temperature than anticipated at high temperatures, in a specific place that doesn't have any thermal monitoring, so the system has no way to know that the problem is occurring.