The previous advances in thickness were due to dropping the optical disc drive, new hard drive format, soldered in RAM, smaller logic board and new battery design. There aren't any developments of similar significance to make now. Given the thermal envelope they have to adhere to too cool the processors sufficiently, Apple can't go much thinner than the current models without having to move down to a lower power category of processors.
I would like the same thickness and thinner bezels and smaller width and depth dimensions.
I would like the same thickness and thinner bezels and smaller width and depth dimensions.