As long as Apple sticks to the model where the laptop users have to paid for features they can't use to make the "Ultra" work, the Extreme has major problems. The problem is not just more pervasive and capable interconnects between the dies. It is also affordability.
Would moving to a 3nm die shrink address that concern?
No, not in and of itself. In some aspects it actually gets worse with TSMC N3! N3 wafers are more expensive. This subsidity is leveraged on making laptop folks pay for a section of die that is worthless to them. If the wafer is more expensive then this wasted die is more expensive also.
So for some rough examples. If for 2M Max dies Apple was wasting 100 wafers on effectively useless UltraFusion connector, then for a $14K wafer then comes to a $1.4M 'waste tax' . For $20K N3 wafer then is a $2M 'waste tax'. If N2 goes up to $22K wafer costs , then it is a $2.2M 'waste tax'. As the wafer costs go up ... so does the tax laptop Max users.
It is a bit worse than that because the UltraFusion is
not going to shrink. N3 is only a decrease in size of logic ( think of that as circuits that compute). The I/O ( which is a major component of what UF does) and SRAM/cache does not. So the I/O and SRAM parts of the N3 dies are getting more expensive also with N3 wafers (and will again with N2).
It is going to make less and less sense to inflict a chiplet connector on something that is primarily intended to be a monolithic die. The SRAM and I/O not shriking will likely eventually force Apple off the monolithic path in parts of the laptop line up, but I think Apple will 'fight' that move for as long as they possibly can. It is just incrementally better Pref/Watt to stay monolithic and Apple isn't charging 'deep discount' prices for Mn , Mn Pro , or Mn Max SoCs.
In my head a MBP 16" would be able to handle a M3 Ultra in terms of physical size, power consumption and thermals because it is a now a 3nm chip.
You are doing shallow system analysis. The RAM packages are
not on N3. So they aren't going to shrink at all. The Ultra is
STILL going to need just as many RAM packages as it has now! The only pragmatic way to squeeze an Ultra onto the laptop board space constraints would be to throw away memory bandwidth. That means throwing away performance. So would buy some 'bragging rights' system that ran great "suck benchmark into local die cache and run it a brief time" , but not particularly great broad real world app performance.
The Mn Max dies have monstrous amounts of SRAM L2/L3-"System Level cache". N3 is going to next to nothing for those in terms of area saving; no 'shrink'.
They also have a relatively large number of memory controllers. Where those controllers go out to reach out the RAM packages ... again very diminished gains (or at least very limited ) gains. May get 'fancier , but almost free' interactions with the Memory packages ( some 'on the fly' memory compression , ECC computations , etc. ) but the path off the die isn't going to shrink as much.
Intel demonstrated that there is a demand for Ultra-class chips on laptops.
Intel is doing NOTHING like Ultra-class chips in laptops. Only at the most superficial level are they lined. If spinning about Meteor Lake is using 4 tiles/chiplets and 3D interposers that part is similar. But the I/O throughput is not even in the same zip code , let alone a demonstration.
And what Intel is doing is not more affordable. They are doing this in part because they have to. They don't have the equipment to make enough Intel 4 dies to populate most of the tiles on Meteor lake set up. If AMD chooses to get into a very hefty 'price war' with Intel , then Intel would be boxed into a corner. AMD probably won't because they have a ton of expensive bills to pay also. But they also have the same problem because TSMC probably can't cover all of the Intel 4 dies production either on top of their other commitments. [ AMD just needs to boils the frog slowly to pull share away from Intel over time. ]
Those buying a M3 Ultra laptop would readily accept shorter battery life in exchange for for a portable Mac Studio.
It isn't just as shorter battery. It would be a substantially thicker case also. And with max dense aluminum option taken that is substantially more weight.
Apple could get some more logic board space to place the additional Memory packages by just going to a twice as big single fan ( big as in taller. ). But that bigger single fan likely will more often have to spin faster and generation substantively more noise.
So battery life ... diminished. Lightweight ... diminished . Low noise ... diminished.
The final major problem is that Apple only has a limited amount of Industrial Design throughput. They are not built to do 10 different Mac models like Dell/HP/Lenovo are for Windows. Those folks try to make everything for everybody. Apple does not. The new MBA 15" very likely puts the MBP 13" at threat of being dropped. I suspect Apple won't drop it for M3, but it would lumber on in a comatose state as far as the Industrial design went. If the MBA 15" does better than expected then it probably dies.
The number of Mac models expanded a bit with the MBA 15" but that is only because another model is going comatose on design updates.
Apple does the MBP 16" so they don't have to do a 17-18" models. Another "bigger and luggable" laptop ? there isn't tons of unit volume in that space to support it. Ditto why Apple isn't doing a xMac box with slots in between the Mini and Mac Pro.
When Apple gets to a Mn Max on N3P or N2 that will be close enough spitting distance to the M1/M2 Ultra that it won't matter. Apple has resources to 'afford' the time to wait for the tech to come to them, rather than chase it now into a niche of a niche upper end laptop market with yet another form factor they don't have structure to chase after.