I do not want much
Apple if you reading this please add an 2" to hight and give us 3 SSD bays and an extra CPU slot
That won't physically work.
A 2nd CPU socket would pragmatically need another 4 DIMM slots. Not going to get 4 DIMM slots in 2" taller cylinder. No way, no how.
A 2nd CPU socket also would throw the thermal core out of whack and a 2" taller core isn't going to cut it anyway. The clocks on the GPUs are already chopped down. Another major heat source would chop them down more.
Mac Pro is currently PCIe lane oversubscribed. Questionable they can round up another x4 lanes for a 2nd SSD. Highly unlikely going to find 8 more lanes. Can just crank up the oversubscription but all doing is diluting the bandwidth to these SSD. Highly doubtful Apple (or a large percentage of customers ) is going to bite on slower throughput SSDs.
The real reality is that next gen E5 will have more cores ( which over longer term decreases the need for dual CPU packages). Higher core counts will simply be packed into a single package. Similarly memory densities will increase. 128GB , 256GB , etc... over time those will fit in 4 DIMM slots. There is a long and very established track record showing exactly that over last 20 years.
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Just added native support for USB 3.0 on Haswell chipset to wishlist.
That is already basically announced already by Intel. The next generation C610 (Wellsburg ) chipset that matches E5 v3 (Haswell) has USB 3.0.
http://www.xbitlabs.com/news/cpu/di...icroprocessors_for_Launch_in_2015_Report.html
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Just need GPU card upgrades,
I wouldn't hold my breath on these GPU connectors working with new, next gen GPU boards. Saddling with Crossfire more likely makes them "one offs".
The next design would hopefully enable the option of getting into the GPU upgrade service, but Apple needs to plan and develop on multiple fronts to enable that.
and a new CPU card when the new processors are out...
New CPUs need new chipsets. Those are on different boards. By time have swapped out 4-5 boards ( CPU , cihipset/backplane, GPU , GPU . and possible I/O port board ) pragmatically have bought a new computer. There is hardly anything left.
For example in next generation chipset USB 3.0 is in the core chipset. Right now that is implement on the I/O port board. Next generation the board placement changes.