This is the question; assuming we get an ASi Mac Pro, what form will the CPU/GPU come in...?
Since I am supervising an exam and don't have anything constructive to do, I'll bite.
- AMD-style CPU & GPU chiplets with a larger (process) I/O die/memory controllers/whatnot...?
I doubt that Apple will use this kind of solution because of its drawbacks. Apple has much more sophisticated technology in the pipeline (e.g. die stacking)
- Nvidia-style SuperChip...?
Nvidia's super chip is basically an M1 Ultra, just with a slower connector and specialised dies. If anything, I'd describe Grace Hopper as an "Apple-style chip".
I don't think Apple will go this route simply because Mac Pro is a low-volume product and it will be very cost-inefficient to make two specialised dies just for it. There is a reason why Nvidia charges 8-digit sums for their "superchip".
- Two Mn Ultra daughtercards on a proprietary high-speed backplane...?
That's my personal favourite, but comes with its own set of challenges. Will Apple be interested in going that route? Who knows...
- Mn Extreme (quad SoC configuration) on new interface/packaging technology...?
Rather unlikely, me things. There is no indication that they have a quad SoC technology close to release. Usually there is a flurry of patents close before product release, but everything we saw for M2 specifically mentions two dies. But everything is possible, I suppose...
I like the SuperChip, because it is similar to the asymmetrical SoC concept; one "regular" Mn Max SoC UltraFusioned to a "GPU-specific" SoC; for a CPU-cores to GPU-cores ratio that favors the GPU-core count...
Yeah, that's certainly an advantage. Another advantage is that you can use specialised RAM for each die without losing the UMA property. But again, I don't think Apple will go that route. Overclocked M2 Ultra is more likely, and multiple overclocked M2 Ultra boards would be even better.