I am following this thread with great interest - I do not own the Mac Studio, nor have I ordered one. I am just a prospect buyer to replace a Mac mini if/when needed. My observations are that the Mac Studio cooling architecture and fan profile has not been engineered properly, there is a lot to be desired. Of corse it is a small enclosure, but there is so much more that can be done within those small boundaries:
1. There is no need for such a cool and power efficient chip to be cooled all the time at this high 1300 RPM.
2. Even when used at 100% the fans stay the same RPM and the chip is at 65°C or lower.
3. If the power supply needs cooling (which I doubt at the minimal power consumption of the chip and its efficiency) - then why is the power supply at the bottom and not at the top of the enclosure so that its hot air is exhausted immediately not to affect other system components? Why not have a separate air tunnel for the power supply alone, like dedicate one of the fans to it?
4. Two small turbine fans will make more noise than one large turbine fan with proper air channels at lower RPM. Why two fans were needed?
5. The perforation holes of the chassis may be too small. I can see why this may be intentional at the bottom to collect dust particles (acting as a filter), but at the rear, those are clearly too small and may create unnecessary pressure in the enclosure. Has anyone counted the perforated wholes on the bottom and at the rear to see if they are equal number (for equal in-out air flow without causing pressure)? The Mac mini has just one large exhaust hole in the back for air to come out.
6. Even the geometry of the perforation holes can create noise, they are just round with sharp edges. Usually to minimize noise, honey-cone perforation is used to avoid and break turbulence etc. Like in the Mac Pro that whole "cheese-grater" thing.
7. From the tear down-videos, I did not really see any guided air-channeling for cooling. The power supply and the "logic board" are just layered on top of each other, and there are no separate guides to channel the air for individual cooling. The chip is cooled by heat pipes and heat sink, but the air sucked through it is already heated by the power supply.