Those should be AC coupling capacitors for one of the PCIe lanes, they are 0.22 uF 0201 capacitors, you can buy them from any electronics component distributor.Hi
dosdude1
I have A2348 and I was trying to upgrade but I lost some components. Is it possible to know what these capacitors cost and where I can get them? Thank you for your reply.
Yes, that should work fine assuming the dumps provided by JCID tool are good (I have ran into some that were not).View attachment 2520218
can we use this method of to write the data to nands for m4 air and base MacBook Pro m4(2 nand configs) with the config of an m4 Mac mini?
little unsure as it uses u8600 and u8700 instead of un000 and un100
any ideas?
Probably used re-programmed NANDs, if so, DD-ing zeroes to the whole drive from recovery mode and performing another DFU restore afterwards will resolve it.Hi
dosdude1
The upgrade was successful, thanks to God and your grace, but after the upgrade the speed decreased read
A simple note NANDs general state
Just a decoupling cap, can be omitted.View attachment 2520895
Is this an essential capacitor or just a decoupling capacitor? Not exactly sure how to tell the difference
The method worked.Probably used re-programmed NANDs, if so, DD-ing zeroes to the whole drive from recovery mode and performing another DFU restore afterwards will resolve it.
In the future, please don't add underfill-like material back to newly installed chips. It doesn't do anything, as real underfill is actually injected underneath the chip with a tiny needle and hardens underneath the chip as well as around it (for structural support), which anything that requires UV light to cure obviously won't be able to do. Adding material in-place of underfill in the manner you did doesn't do anything other than make a huge mess the next time the chips need to be removed again.The method worked.
You are rightIn the future, please don't add underfill-like material back to newly installed chips. It doesn't do anything, as real underfill is actually injected underneath the chip with a tiny needle and hardens underneath the chip as well as around it (for structural support), which anything that requires UV light to cure obviously won't be able to do. Adding material in-place of underfill in the manner you did doesn't do anything other than make a huge mess the next time the chips need to be removed again.