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In case anyone is interested , you can install a X5690 (with a 130 W TDP) in a single processor Mac Pro 5,1 (or Mac Pro 4,1 > 5,1) without modifying the factory fan speeds . This is because Apple used a hot chip , a W3680 (130 W TDP) in the single 3.33 GHz 6 Core , so the factory SMC is prepared for your Big Boy chip .

With regards to the Dual X5690 (12 Core) Mac Pro 5,1 (or Mac Pro 4,1 > 5,1) , the story is entirely different . Hottest pair of chips used by Apple were a pair of X5675 (with a 95 W TDP) 3.06 GHz 6 cores . The TDP of these chips is a lot lower than a pair of X5690 (130 W TDP each) Big Boys you just installed . This is about 30 percent higher than Apple's hottest 12 Core . With these systems, you need to bump up the case fans with SMCfancontrol to keep the Big Boy chips cool at load . There will be an increase in noise , but aim for 1600 RPM for the air intake , PSU ,PCI and exhaust fans . Both Booster fans will rise to their own level automatically due to factory SMC kicking in (I think around 2400 RPM) . This you cannot change . Aim for Tjunctions not hotter than 78 C .
 
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Glad the processors are working out for you Larry, mine is too and I am over the mess left by Aventis when they pulled it for sale.

I got Bresink's Hardware Monitor yesterday and all seems really good, no big differences between the heat sink and CPU temps and no higher than 124F under the heaviest sustained loads with SMC fan control off.

These sure are great machines to mod and get to know inside and out...
Hey Macshroomer,

at this point we both look pretty lucky, have you considered any other temperature monitoring than Bresink?

I'll have to wait till the weekend to give the 12-core a workout, I still have a lot of things to install, and no time to do it in.

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In case anyone is interested , you can install a X5690 (with a 130 W TDP) in a single processor Mac Pro 5,1 (or Mac Pro 4,1 > 5,1) without modifying the factory fan speeds . This is because Apple used a hot chip , a W3680 (130 W TDP) in the single 3.33 GHz 6 Core , so the factory SMC is prepared for your Big Boy chip .

With regards to the Dual X5690 (12 Core) Mac Pro 5,1 (or Mac Pro 4,1 > 5,1) , the story is entirely different . Hottest pair of chips used by Apple were a pair of X5675 (with a 95 W TDP) 3.06 GHz 6 cores . The TDP of these chips is a lot lower than a pair of X5690 (130 W TDP each) Big Boys you just installed . This is about 30 percent higher than Apple's hottest 12 Core . With these systems, you need to bump up the case fans with SMCfancontrol to keep the Big Boy chips cool at load . There will be an increase in noise , but aim for 1600 RPM for the air intake , PSU ,PCI and exhaust fans . Both Booster fans will rise to their own level automatically due to factory SMC kicking in (I think around 2400 RPM) . This you cannot change . Aim for Tjunctions not hotter than 78 C .

Hmmm, could have sworn there was a 12-core 3.33 available, but I don't see anything to support that.
 
In case anyone is interested , you can install a X5690 (with a 130 W TDP) in a single processor Mac Pro 5,1 (or Mac Pro 4,1 > 5,1) without modifying the factory fan speeds . This is because Apple used a hot chip , a W3680 (130 W TDP) in the single 3.33 GHz 6 Core , so the factory SMC is prepared for your Big Boy chip .

This kind of makes me happy that I got single processor 5,1. :D
I bought quad 2.8 and just upgraded to X5690 last week and it just simply works without any issue, my temps is below 50C.
 
This kind of makes me happy that I got single processor 5,1. :D
I bought quad 2.8 and just upgraded to X5690 last week and it just simply works without any issue, my temps is below 50C.

Same here. I upgraded a quad 3.2 to a W3690 so I shouldn't even be participating in this thread.:eek:
 
Machines thanks for the point on running dual and adjusting fan control its really helped. Is SMCFanControl a better choice than just doing it in iStat assuming I'm always in OS X (not windows etc.) New to this and the fan adjustment I've made is definitely an improvement.

Hmmm, could have sworn there was a 12-core 3.33 available, but I don't see anything to support that.

There are 6-core 3.33s - there are 12-core chips but to my knowledge beyond being cost prohibitive I dont think an MP could support them.
 
Machines thanks for the point on running dual and adjusting fan control its really helped. Is SMCFanControl a better choice than just doing it in iStat assuming I'm always in OS X (not windows etc.) New to this and the fan adjustment I've made is definitely an improvement.

There are lots of good choices for fans control now and I don't know if you can really say any particular one is by far the best. SMCFanControl probably has the most options and iStat lets you create profiles but not ones with temp triggers.

I use this one now: http://www.crystalidea.com/macs-fan-control although that's primarily because it works well for me *and* it has a Windows version as well that looks/works exactly the same. I have to use bootcamp a fair amount on my Pro and I like that I can setup the same fan control on both sides. :)

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With these systems, you need to bump up the case fans with SMCfancontrol to keep the Big Boy chips cool at load . There will be an increase in noise , but aim for 1600 RPM for the air intake , PSU ,PCI and exhaust fans . Both Booster fans will rise to their own level automatically due to factory SMC kicking in (I think around 2400 RPM) . This you cannot change . Aim for Tjunctions not hotter than 78 C .

Are you talking about when under load? Those fan speeds are way higher than what I have configured on my 4,1-5,1 dual X5690 Pro and mine stays quite cool. The only two fans I alter to give higher minimums to are intake and exhaust.
 
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My fans are running at - See attached.

CPUs - X5677 X 2

Lou
 

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Are you talking about when under load? Those fan speeds are way higher than what I have configured on my 4,1-5,1 dual X5690 Pro and mine stays quite cool. The only two fans I alter to give higher minimums to are intake and exhaust.

Of course, under load . Please keep in mind many of my local clients use these builds to do some very heavy rendering over an extended period of time , so they must be kept cool . Operational life of a Classic Mac Pro is likely 10-20 years if given proper maintenance and a good environment . That means, in part, keeping things cool so that the thermal paste does not evaporate too soon . I come from an industrial background . Industry guys are used to keeping equipment in terms of decades , even generations . Why not a Nehalem Mac ? Three of my clients use PMG4s that are nearly 15 years old . A vinyl cutter , a print shop and an radio advertising agency . Their gear lives because they are lovingly cared for .
 
fastest available CPUs from the factory were 2x hexa-core clocked at 3.06 GHz.
Finally remembered where I saw it, Digilloyd's blog.

He had OWC put a 12-core 3.33 together, back when I bought my 6-core. His tests indicated that, for a lot of common tasks, the 6-core was actually faster, so I went with one at that point.

I'll have to search his archives and see if he ever had any heating issues on those processors.
 
ok, I'm totally stoked! I got my 5,1 12 core upgraded from 2.4 to 3.46 GHz. Oddly, it is noticeably faster with even simple tasks, and FCPX and a few games I tried are much faster!

I have tried out a few temperature and fan monitoring software programs. I must not be looking in the right place, but does smcfancontrol let you see the temperatures of individual internal components?
 
Got my processors in from Aventis this morning(2x3.46) and did the upgrade; About two years ago I upgraded this 4,1 from 2x2.66 to 2x3.33 and admittedly that upgrade went far quicker; Perhaps it was just dumb luck that the machine posted right away.

I had some reservations of going from the W5590s to the X5690 simply because it's served me so well and I really wasn't looking forward to cracking open that heatsink again. Fortunately I was able to boot up right away with one CPU and both CPUs, however, the fans were on full blast and I lost track how many times I removed the tray and re-tightened the screws; As a last ditch effort I removed both heatsinks, cleaned and reapplied paste, and made sure the fan connectors were in place before screwing in the heatsink. I was about to give up for the night but on the last attempt it booted up fine without gale force winds. It's actually running slightly cooler than my W5590s at idle and I'm looking forward to getting my GTX980 back from MVC.
 
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ok, I'm totally stoked! I got my 5,1 12 core upgraded from 2.4 to 3.46 GHz. Oddly, it is noticeably faster with even simple tasks, and FCPX and a few games I tried are much faster!

I have tried out a few temperature and fan monitoring software programs. I must not be looking in the right place, but does smcfancontrol let you see the temperatures of individual internal components?

I've gone from a 4.1 2x2.26 (still in the sig, need to update that) to "5.1" 2x3.33 (the x5680... not the x5690 but really close haha) and agree that the difference even in small things is noticeable. I love it.

Machines posted a link above when I was asking about fan control, not sure about smcfancontrol but I think it does. He posted a link to Mac Fan Control and I was going to check it out over the weekend.
 
Fortunately I was able to boot up right away with one CPU and both CPUs, however, the fans were on full blast and I lost track how many times I removed the tray and re-tightened the screws; As a last ditch effort I removed both heatsinks, cleaned and reapplied paste, and made sure the fan connectors were in place before screwing in the heatsink. I was about to give up for the night but on the last attempt it booted up fine without gale force winds.

What did the paste dispersion look like when you removed the heat sinks? If I was betting on the problem I'd put my money on mis-seated fan connectors.
 
What did the paste dispersion look like when you removed the heat sinks? If I was betting on the problem I'd put my money on mis-seated fan connectors.

This is the second time upgrading the CPUS in this machine and to be honest I can't remember how the original factory paste looked. Like the W5590s, I just applied a pea sized bead and spread it evenly with a latex glove.

It was the fan connectors and I didn't clip them the first time around and I didn't this time; They're pretty fiddly.
 
Has anyone had any issues using a de-lidded x5690 pair of processors to perform this upgrade? Is this something to avoid? Or is it a better fit considering the old processors were de-lidded?

Also, is there a different thermal paste application for a de-lidded processor?
 
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Has anyone had any issues using a de-lidded x5690 pair of processors to perform this upgrade? Is this something to avoid? Or is it a better fit considering the old processors were de-lidded?

Also, is there a different thermal paste application for a de-lidded processor?

Lidded or De lidded depends on what gen (3.1,4.1,5.1) box you have. 5.1's are lidded, 4.1's delidded and I'm not sure on 3.1's. While I have heard of instances of folks running deliddeds on non delidded versions or vice versa (not sure which just remember seeing it), it's not something I would do.

There are mechanical differences in the heights by having the IHS in place, granted not much and perhaps the heat sinks could have enough slack to take up the gap but I wouldn't do it.

As for the paste, I i'm pretty sure that doesn't matter, as people use arctic silver on lidded CPU's and unloaded GPU's. However I'd defer to the experts on that.
 
Also, is there a different thermal paste application for a de-lidded processor?

I think the general advice is to use a non-conductive (ex: ceramique 2) on de-lidded processors, since there is the potential to create a short with conductive compound on the exposed cpu.
 
Waiting for my Xeon to arrive. I believe the thermal paste pattern is a circle with a sideways line through the middle. You don't spread it around, just put the heat sink on it after it's cleaned.
 
Does anyone knows if an Intel Xeon X5690 3.46GHz processor are compatible with a Mac Pro 2010 with a mono Quad Core 3.2GHz? If I'm asking this question, it is because I know that the Intel Xeon 5600 series are designed for dual-processor, hence my question. In other words, does someone has already successfully tested a X5680 or X5690 Xeon on Mac Pro 2010 with a single CPU?

Thank you.

My Post from another thread:

Intel's Part Number Descriptions Explained here:

Intel has changed what the leading Alpha means. The change happened when going from the 35XX (55XX) to the 36XX (56XX) series.

In the older series it meant:

E = Enterprise and CPUs with a TDP of 80 Watts
X = Accelerated and CPUs with a TDP of 95 Watts
W = Workstation and CPUs with a TDP of 130 Watts

and in every case the leading numeric after the alpha meant:

3 = for single CPU use only (1 x I/O Bus)
5 = for dual CPU use, but will work in single CPU applications (2 x I/O Bus)

the the later series, the above nomenclature rules stayed constant EXCEPT - The "X" prefix means accelerated (95 or 130 watt TDP) and is only used on CPUs with a 2 x I/O bus. The "W" prefix is now used only in the single CPU series (1 X I/O Bus).

In any case in both series, the meaning of leading numeric after the alpha has remained the same. A "3" for CPUs with a 1 x I/O bus and a "5" for CPUs with a 2 X I/O Bus.

I hope this makes sense to you. It took me awhile to figure it out.

The answer to your question is YES!!!!!

Lou
 
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I think the general advice is to use a non-conductive (ex: ceramique 2) on de-lidded processors, since there is the potential to create a short with conductive compound on the exposed cpu.

Waiting for my Xeon to arrive. I believe the thermal paste pattern is a circle with a sideways line through the middle. You don't spread it around, just put the heat sink on it after it's cleaned.

I wouldn't sweat it too much. I've always spread a very thin layer, evenly across the surface of the heat spreader (or in this case, the die itself) with a razor blade. This way, I have control with how thick it is, and I know, for a fact, that there is even coverage. Other methods, while recommended, leave it as a mystery whether you got even coverage or if uneven tightening of the heatsink lead to uneven die coverage and/or a mess under the heatsink with too much compound.

With regards to *what* to use, my delidded X5680's had what to me looked like solder covering the dies. I shaved it off with a razor, bit by bit, until it was as removed and smooth as I could get it. I'm pretty sure whatever it was, it was conductive, as it was silver, shiny and shaved off like soft solder.

My X5680's idle in the mid-to-high 30C (typically around 38C). I think that is about perfect.
 
I wouldn't sweat it too much. I've always spread a very thin layer, evenly across the surface of the heat spreader (or in this case, the die itself) with a razor blade. This way, I have control with how thick it is, and I know, for a fact, that there is even coverage. Other methods, while recommended, leave it as a mystery whether you got even coverage or if uneven tightening of the heatsink lead to uneven die coverage and/or a mess under the heatsink with too much compound.

That's the method that I use also, although I spread the thermal compound with a credit card. Having control over the thickness of the compound over the entire portion of the heatsink is important to me.

Lou
 
I have a question about "de-lidding" as well.

I'm just about to buy a pair of x5680's to put into a dual 4,1 2009 Mac Pro (with the 5,1 firmware update). Are people de-lidding these first? or just putting them in as they are?
 
Both way works, however, IMO, de-lid is the better way to do it, less risk to damage the CPU tray. Even though higher risk to damage the CPU and cost a bit more, but CPU is actually cheaper and easier to replace than the CPU tray now.
 
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