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dec, the same reason they dropped USB-A in rMBP 2016 will go for nMP for sure. For 9USD you get an adapter (or a few in case you need more). I really believe they'll ditch it for good.
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Same reason? Thinner laptop same reason? It is probably going to be at least 6" tall. Thinner USB sockets buys a whole lot of nothing. There is a no lack of available space resource excuse here even in the slightest.
headphone on iPhone .... booted for haptic engine for virtual button. (i.e., ran out of space. )
MBP 2016 ... even thinner than MBA approaching MacBook thinness .... MagSafe and USB Type A booted (i.e., ran out of space. ) No space excuse for headphone jack ejection .... kept it.
Mac Pro no space excuse for power connector , USB type A , HDMI , or heaphone jack being dropped at all. Apple could ditch those will no rational justification but .... more than a few folks will ditch Apple also. The Mac Pro can still advance the Type-C adoption cause buy using those for TBv3.
Wired keyboards and mice will either disappear or come bundled with the adapter (or you'll need to buy one, the Apple way). Maybe USB hubs with type A and C?
Apple has been saddled with the "PCIe slots for more wires" stuff with TB over last 3-4 years with Mac Pro. Adding a large onslaught of dongles on top is just going to be more negative publicity. Especially when tossing the TBv2 (
and miniDP ) folks into the dongle solution. That is 6 sockets that may need more cabling. To make it 10 sockets is just simply inviting grief. Lots of it.
I'm with you regarding the LG monitor but how much more would it take to make it TB3? I guess there was no need, possibly made for the rMB.
Lower price and expand the market of compatible laptops. Not just rMB. Google Pixel Chromebook (incremental bump for sure), and other WinPC Type-C laptops. ( should be plenty coming by CES 2017 show in a little over a month).
And -W and KBL PCH (Basin Falls) fits perfectly in nMP, it's even good for Cannon Lake-W if for some reason Apple decides to
I don't think the -W ( -X) line up are going to go to "Cannon Lake" (i.e., 10nm ). Seems more likely will move their very large dies to 14nm+ (taller fins ) in something more of a "Coffee Lake" optimization rather than a shrink. Intel may skip 10nm altogether for these larger dies. Or at least not move the larger ones to 10nm until the smallest ones have moved off to 7nm ( or any 10nm+ they come up with).
Relatively high count, "full sized" cores with max die sizes don't mix well with bleeding edge process tech. More optimized process tech is more effective (profitable. ).