And if we do not get a new modular Mac Pro, it will crash into the keynote, the hydrogen gas within igniting in a deadly fireball...!
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MP 7,1 Waiting for Mac Pro 7,1 A1991 (no more)
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And if we do not get a new modular Mac Pro, it will crash into the keynote, the hydrogen gas within igniting in a deadly fireball...!
New rumors about the mMP L19: a revised trashcan was shown to few testers under NDA, taller and a bit wider than tcMP13 improved thermal core, upgradeable GPU twice faster PCIE SSD than iMac pro (either PCIe4 or x8 PCIE3) Vegas GPUs only still no clue on TR3/Epyc or Xeon-W...
Now we have 2 likely possible mMP, another tcMP and an hybrid TC/cheese grater MP.
Now we have 2 likely possible mMP, another tcMP and an hybrid TC/cheese grater MP.
Sorry but your sources (if they exist) are obviously bogus, since you have now presented two totally different scenarios. Besides, I would never believe they would do a trashcan V2. Even Apple aren't that stupid. So let's just see what they hopefully show at WWDC. Your bet is as good/bad as anyones, obviously.
Goodyear Blimp uses Helium. ( as more HDDs soak up the Helium supply that may turn into problem over the long term. ) Perhaps get a keynote that sounded like Mickey Mouse from the gas.
The current ones are semi-rigid dirigible so decent chance would have some damage and perhaps injured people below.
The San Jose Convention center is relatively close to the flight path of SJC landing/take-off traffic. It is somewhat of a 'no fly' zone for something this large to stay on station for a long time .
How does the saying go ? If you make a mistake, do it again ... then call it jazz.
I use to dig Into darknet forums, the source is what you get, in darknet you only own pk and it's reputation, my source is that someone with good leak record signing with his/her pk.
At this point I consider the hybrid tcMP/cgMP should be the next mMP or at least the one most people will be Happy to own, but don't discard apple just getting stick with Mac design as they don't change the general design of a Mac since the last MBP, even the Mac mini keep it's design.
No joke don't get surprised by another tcMP just tricked to handle 600-800W TDP and come with full AMD inside.
If they can handle the thermal load without throttling & the price is right, I am down, especially if it is AMD inside...!
Either a vertical cheesegrater or a trash can modified like below fit the vertical airflow & dual top fans you referenced before...
Dual PCIe 4.0 x16 slots / T2/SSD syste, / TB3 ports / Dual 10Gb Ethernet / system chipset - that should eat up the 60 lanes available from Threadripper...
But are we looking at proprietary GPU(s) again, or will there be PCI slots as you stated before...?
You aren't referencing the older modified trash can mock-ups, are you...?
Only issue with these renders are the exhaust on the blower GPU facing down rather than up...
I would rather see open air GPUs with perforated intakes on the side panels...
Intake from the bottom & sides, exhaust out the top...
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That would make absolutely no sense. Why use “painting themselves into a thermal corner” as an excuse for the lack of ipdates only to repeat the same design?
Trashcan 2.0 is more likely than any of the stackable concept designs I've seen. I still think the mMP will be a tower though. Since when does Apple think different? The Apple Watch has a rectangular display, the same iMac design since 2012, 4th gen butterfly kb. Apple thinks of straightforward designs, they said it will be modular and easy to upgrade. I don't think Apple is going to abandon their quest for miniaturization so it will be a small tower. It will feature a T2 chip, no T3 as confirmed by the 2019 mbp refresh. It will feature a soldered on SSD: 500gb, 1tb, 2tb, 4tb. The GPU is still a mystery but it could be a regular AMD card with a proprietary interface. No Nvidia. No AMD or Arm CPU, we will get Intel Xeon and 2666mhz RAM. Socketed CPU and RAM.
How many generations have they gone with that worthless keyboard on the MBP?
I tend to think the GPU cooling will be more creative than simply a blower (or worse yet, a bunch of fans) on the GPU itself. The problem, of course, is that anything else breaks compatibility with PC GPUs - but I think Apple probably sees that as an advantage.
It'll either be fan-cooled with a big, slow, quiet fan as part of the computer (not part of the GPU), or it'll be liquid cooled - either way,GPU cooling will be integrated into system cooling. It's possible to build a cooling system that is much quieter per watt dissipated than the standard PC GPU cooling scheme (it would be hard to do worse!). The scheme we have is a hack as GPUs got more and more powerful, but nobody wanted to break compatibility - so manufacturers simply piled on more noisy fans (and power connectors made for other purposes).
Apple will break compatibility and do something better - It'll be powered through the slot and cooled through the system. It may be otherwise standard PCIe (a PCIe slot extended with extra power and the Thunderbolt pass-through connector and with a cooling duct or attached to a cooled plate), it may be a differently-shaped card with an odd connector, or it may be some sort of cartridge design, potentially with mating liquid-cooling connectors. Whatever it is, it will be upgradeable, but it won't be compatible with PC-type PCIe graphics cards. The data interface probably will be PCIe of some sort or another, but it won't be the same power and cooling standards.
It'll either be fan-cooled with a big, slow, quiet fan as part of the computer (not part of the GPU), or it'll be liquid cooled - either way,GPU cooling will be integrated into system cooling. It's possible to build a cooling system that is much quieter per watt dissipated than the standard PC GPU cooling scheme (it would be hard to do worse!). The scheme we have is a hack as GPUs got more and more powerful, but nobody wanted to break compatibility - so manufacturers simply piled on more noisy fans (and power connectors made for other purposes).
Apple will break compatibility and do something better - It'll be powered through the slot and cooled through the system. It may be otherwise standard PCIe (a PCIe slot extended with extra power and the Thunderbolt pass-through connector and with a cooling duct or attached to a cooled plate), it may be a differently-shaped card with an odd connector, or it may be some sort of cartridge design, potentially with mating liquid-cooling connectors. Whatever it is, it will be upgradeable, but it won't be compatible with PC-type PCIe graphics cards. The data interface probably will be PCIe of some sort or another, but it won't be the same power and cooling standards.
They still have yet to characterize the butterfly keyboard as being in a corner.
If look over at last couple of days at Computex there have been some more "low travel" laptop keyboards revealed. Also more "concept" screen as a keyboard models demo'ed.
It looks like these new key mechanisms are a bit more expensive and that part of the problem was too much Scrooge McDuck. That aspect technically isn't a design corner. stronger membrane and more heat and force resilent components probably do make a substantive difference but they also probably add to the bill of material costs too. ( Not that the couple dollars Apple 'saved' going cheap ( and "greener" ) would have made a huge difference on the bank account (or the planet) ).
We will see XCode on iPad (Pro) before we do on Windows, I imagine. 
As for Apple releasing a revised product based heavily on the "Trash Can", they would not need six years to do that.
I believe danwells is on to something in regards to cooling - the Mac Pro has always been quiet as has the iMac Pro. So they're going to want something that has sufficient internal volume to allow the use of large-diameter fans to move a lot of air at low RPM and giving them the thermal overhead to support hotter CPUs and GPUs down the road (no "thermal corners") without needing to engage "Hair Dryer Mode".
As for Apple releasing a revised product based heavily on the "Trash Can", they would not need six years to do that.
I believe danwells is on to something in regards to cooling - the Mac Pro has always been quiet as has the iMac Pro. So they're going to want something that has sufficient internal volume to allow the use of large-diameter fans to move a lot of air at low RPM and giving them the thermal overhead to support hotter CPUs and GPUs down the road (no "thermal corners") without needing to engage "Hair Dryer Mode".
trying to solder 4TB on to the motherboard probably work so well. Same reason way iMac Pro NAND daughter cards aren't soldered in. Even if apple could jam 4TB into the space of just 4 NAND chips , they'd be passing up a 8TB SSD if kept the two daughter card set up.
Extremely likely, there is going to be at least as much room in the next Mac Pro as there is on the iMac Pro's logic board. the T2 chip itself ( the heart and brains of the SSD) will be soldered, but this isn't the interior of a Mac Mini or laptop in play. the vertical height increase will likely have no material impact. The over/under airflow probably will help with the mega capacity card(s).
The 10.14.5 supplemental with T2 fixes is more telling than them speed bumping the 2018 model. Apple doesn't need new silicon as much as they need to figure out better mechanisms for integration. What they need is not a "More poweful" or "broader feature set" iteration. What they need is a T-seires that doesn't cover any more functional areas that is better integrated and less quirks with other subsystems. That's it.
Once they have mastered that then maybe move on to something more complicated, but so far they need 'time out' on feature creep.
Pretty decent chance the GPU isn't going to the "ultimate exotic" choice. Even if they don't announce something new may pop up in the 10.15 beta.
O ye of little faith ...
And Apple released a new trash can, a slightly bigger one, in spacier grey, with faster components, and barely adequate cooling. With a cost only twice as high as the previous trashcan, it was embraced by a quiet few. This was the end of the line for Mac Pro, its design symbolic of its new destination.
they basically just need to make a hp z4. Its a smaller form factor workstation computer with enough of everything to get serous work done. If apple is run by the design department then we will get some over complicated no standards thing that wont get updated.
It's amazing how much time things can take if you never start working on them .
Good point .
We will see XCode on iPad (Pro) before we do on Windows, I imagine.
That would fit the "blow your mind' theme they have on WWDC. A large group of foks would be in 'freak out' mode if apple gets on stage and announces that. Even a mostly stripped down version.
Depends upon how manically focused on the single GPU performance there were. They could have bumped at Polaris but the top end GPU performance wouldn't have gone up much ( it would better handle inside the constraints).
By the time Vega came along they were at the iMac Pro stage of focus. And still would solve core issue of mismatch in TDP between CPU and GPU. ( iMac Pro just gives them room to be apart. )
When Polaris/Vega took so long to roll out that lead up time was probably spent doing mostly nothing. That would have soaked up much of that time span.
They could still put a third part card in a different thermal zone. The concept from ASUS puts the PCI-e slots on the back of the motherboard.
https://www.tomshardware.com/news/asus-prime-utopia-motherboard-concept,39469.html
It isn't an upcoming product, but indicative that Apple also can get trapped in that "super quiet" CPU and GPU cooling if get too myopic. For the standard CPU and GPU apple can couple that to some cooler at very low noise ( and not resorting to dampers to cover the noise after make it). However, blocking out a limited "3rd party" zone they don't need to hit the same noise levels ( and if noisy it is that other part's fault. some folks don't care. So they'll still be happy. )
Don't have to run off to completely seperate boxes in order to leverage some thermal barriers between components.
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